Lasea LS-Profile

The Lasea LS-Profile is available in two specialised variants, each targeting a distinct stage of laser beam characterisation:

LS-Profile Beam — Optical Path Analysis

Measures beam characteristics along the optical path, including beam diameter, divergence, and M² factor. Used to verify beam quality from the laser source through to the final focusing optic.

LS-Profile Spot — Focal Plane Analysis

Characterises the focused spot at the workpiece surface — measuring spot size, shape, and position. Essential for verifying that the focused beam delivers the expected spatial characteristics at the point of material interaction.

Both variants integrate with LASEA’s micromachining platforms and can be used during system commissioning, process development, post-maintenance verification, and routine QA. Measurements are repeatable and non-destructive — no interruption to the machining process is required.W

• Two variants: LS-Profile Beam (optical path) and LS-Profile Spot (focal plane)
• LS-Profile Beam: measures beam diameter, divergence, and M² factor along the optical path
• LS-Profile Spot: measures focused spot size, shape, and position at the workpiece surface
• Integrates with LASEA micromachining platforms
• Non-destructive, repeatable measurement — no process interruption required
• Supports commissioning, process development, post-maintenance checks, and routine QA

• System Commissioning & Acceptance Testing
  • Verify beam quality on delivery or after installation to confirm the system meets specification before production use.
• Post-Maintenance Verification
  • Confirm that beam quality is restored to specification after optics cleaning, lens replacement, or module changes.
• Process Development
  • Characterise and optimise beam parameters during new process development to correlate optical performance with machining outcomes.
• Routine Quality Assurance
  • Periodic beam quality checks in production environments to detect drift before it affects part quality.