Lasea Neo

The LASEA-neo is a next-generation industrial laser micromachining platform engineered for the highest possible throughput without compromising on precision or footprint. Its defining capability is simultaneous multi-part machining: multiple scanner heads, driven by a single 80 W IR femtosecond laser (400 µJ), process several parts at the same time.

Combined with a footprint approximately half that of conventional systems of equivalent output, the LASEA-neo redefines the productivity-per-square-metre benchmark for laser micromachining. A 4-camera industrial vision system eliminates the need for precise manual part positioning  as parts are placed in trays and machining is fully autonomous.

STANDARD EQUIPMENT

• High-power femtosecond laser: 80 W IR, 400 µJ – optimised for rapid, precise machining
• Multiple scanner heads for simultaneous multi-part machining
• High-precision mechanical axes: 500 × 300 × 200 mm
• 4-camera industrial vision system with shape recognition – no precise manual positioning required
• Autonomous machining from trays; remote video access to the work area
• Thermal stabilisation and smoke extraction with fire protection
• User training included; 2-year guarantee

SERVICES / OPTIONS

• Additional specific training
• Autonomous production options (robot, palletiser)
• Custom part holder

• Multiple scanner heads- simultaneous machining of several parts from a single laser source
• Femtosecond laser: 80 W IR, 400 µJ
• High-precision mechanical axes: 500 × 300 × 200 mm; parts up to 40 × 40 mm
• 4-camera vision system- shape recognition, no precise manual positioning required
• Footprint approximately half that of conventional systems- maximises productivity per m²
• Autonomous tray-based machining; remote work area video access
• Thermal stabilisation and smoke extraction with fire protection
• Software: KYLA™, LS-HMI, LS-Cam, LS-Vision

• High-Volume Engraving & Decoration
  • Synchronised multi-head engraving of luxury goods, watch components, and jewellery at production throughputs unachievable with single-head systems.
• Laser Marking & Traceability
  • High-volume batch marking for traceability, branding, and serialisation across electronics, industrial, and luxury manufacturing.
• Surface Texturing
  • Simultaneous texturing of multiple components for functional (tribological, hydrophobic) and decorative (luxury finishes, patterns) applications.
• Thin-Film Removal
  • High-throughput selective decoating of electronics, optics, and solar cell films across multi-part tray setups.
• Electronics Component Processing
  • Simultaneous multi-site laser processing of PCBs and substrate components requiring high positional accuracy.