Edgewave‘s FX-Series Ultrashort Pulse InnoSlab Lasers are femtosecond oscillator and amplifier systems based on InnoSlab technology with power up to 200W and pulse energy 100uJ with a 600fs pulse duration.
Edgewave‘s FX-Series Ultrashort Pulse InnoSlab Lasers are femtosecond oscillator and amplifier systems based on InnoSlab technology with power up to 200W and pulse energy 100uJ with a 600fs pulse duration.
EdgeWave’s ultra short pulse lasers are diode-pumped and mode locked solid-state oscillators and amplifiers. The amplifiers are based on the unique InnoSlab laser technology. Through an optimal combination of crystal shape, cooling and resonator design, ultra short pulse lasers with InnoSlab amplifiers benefit from the compact setup, high efficiency and high amplification factor, excellent beam quality and scalability for multi kW output.
The FX-series of femtosecond oscillator and amplifer systems has the following specs:
OVERVIEW OF FX-SERIES
Model | FXxxx-1 | FXxxx=2 | FXxxx-3 | FXxxx-4 |
---|---|---|---|---|
Wavelength [nm] | IR | Green | UV | DUV |
Highest beam quality M² | 1.1 | 1.1 | 1.1 | 1.1 |
Max. average power [W] | 400 | 200 | 90 | 15 |
Max. repetition rate [MHz] | 50 | 50 | 50 | 50 |
Max. pulse energy [µJ] | 2000 | 900 | 400 | 200 |
Min. pulse width [fs] | 400 | 300 | 300 | 300 |
Energy stability [%] rms | 1 | 2 | 2 | 3 |
Timing stability [ns] | 20 | 20 | 20 | 20 |
Polarisation | > 100:1 | > 100:1 | > 100:1 | > 100:1 |
Beam Ellipticity(farfield)[%] | < 10 | < 10 | < 10 | < 10 |
Diameter at window [mm] | 3 | 3 | 3 | 3 |
Full divergence angle [µrad] | 500 | 250 | 226 | 226 |
Point stability [µrad] | <50 | <50 | <50 | <50 |
Warm-up time from cold start [min] | 15 | 20 | 30 | 30 |
Warm-up time from standby [min] | 10 | 15 | 30 | 30 |
Utility & Ambient Requirements | ||||
Power supply | 90 V-264 V or 180 V-264 V, 50/60 Hz | |||
Power | 1.2 kW-3.6 kW | |||
Chiller | 230, 208, 115, 100 V, 50/60 Hz | |||
Power | 0.8 kW-3.6 kW | |||
Operation ambient temperature | 15 °C-35 °C | |||
Relative humidity, non-condensing | 10 %-80 % | |||
Dimensions & Weights | ||||
Laser head | 650 mm x 298 mm x 150 mm | |||
Supply incl. chiller | 19“x(10HU–15HU)x700mm | |||
Laser head | < 50 kg | |||
Supply incl. chiller | 62 kg-110 kg |
milling, cutting and drilling of
display-glass, sapphire, ceramic, etc.
ablation and structuring of thin layer
precision 3D engraving
milling, drilling and cutting of CFP
laser induced selective etching
rapid prototyping